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    • EV Group
      • EV Group
        EV Group, EVG520IS Semi-Automated Wafer Bonding System
        The EVG520IS single-chamber unit handles wafers up to 200 mm with semi-automated operation for small volume production applications. Redesigned based on customer...
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        Posted 2/26/2008 8:49:06 PM
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    • Semiconductor International
      • Semiconductor International
        Semiconductor International, Technology Library
        more info
        Posted 10/22/2007 5:04:57 PM
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    • EV Group
      • EV Group
        EV Group, Gemini Automated Production Wafer Bonder
        A maximum level of automation and process integration is achieved by the Gemini. Wafer-to-wafer alignment and wafer bonding processes up to 300 mm for volume MEMS...
        more info
        Posted 2/26/2008 8:49:06 PM
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    • EV Group
      • EV Group
        EV Group, IQ Aligner
        Advanced packaging uses photolithographic processes to perform IC packaging at wafer level. The IQ Aligner has universal features suitable for wafer bumping, chip...
        more info
        Posted 2/26/2008 8:49:06 PM
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    • EV Group
      • EV Group
        EV Group, EVG150 Nanospray
        With its new Nano Spray technology EVG has been able to demonstrate, for the first time, conformal coatings of vertical via walls 300µm deep and 100µm diameter. This new milestone in photoresist application will enable users to carryout further lithography steps in the bottom of the via to create through wafer interconnects and allow a new bandwidth of applications throughout many technologies in Semiconductor processing markets.
        more info
        Posted 2/26/2008 8:49:06 PM
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